The technique of wafer bonding is classified into three kinds: field-aided bonding, surface activated bonding, and intermediate layers bonding.
將圓片鍵合的各種工藝分為3類:場助直接鍵合、表面活性鍵合、借助中介層鍵合。
This paper summarized common problems of the rough of the ultra-fine grain cemented carbide round-flat slitter during the productions, and compared the different productions process of the rough round-flat slitter, these gave the powerful proof for produced high quality and eligible ultra-fine cemented carbide productions.
本文就超細(xì)晶粒硬質(zhì)合金圓片刀毛坯在兩種不同生產(chǎn)工藝過程中常見的問題加以綜述,并對圓片刀毛坯的不同生產(chǎn)工藝進(jìn)行對比性研究,為生產(chǎn)高質(zhì)量、高合格率的超細(xì)硬質(zhì)合金產(chǎn)品提供了有力的依據(jù)。
The problems of spots occurring on the surface of products in making molybdenum discs from small molybdenum slabs are mainly studied.
主要研究了小鉬板坯在制成鉬圓片的過程中產(chǎn)品表面易出現(xiàn)麻點(diǎn)、黃斑的問題,通過實(shí)驗(yàn)找到了問題產(chǎn)生的一些原因,特別指出了原料中的雜質(zhì)含量對鉬圓片的質(zhì)量有著重要影響。
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